Dislocation Reduction on Simox Substrates by Using Multiple Implants

Author:

Cheek Tom F.,Chen Daniel

Abstract

AbstractA technique for dislocation density reduction in SIMOX (Separation by IMplantation of OXygen) substrates by using multiple implant and anneal cycles is described. This scheme produces SIMOX material with dislocation defect densities less than 1 x 105/cm2. This dislocation density value is three to four orders of magnitude lower than that of comparable single implant slices having the same total dose and anneal conditions.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Structural defects in SIMOX;Ion Beam Processing of Materials and Deposition Processes of Protective Coatings;1996

2. A novel appproach to secondary defect reduction in separation by implantation of oxygen material;Journal of Applied Physics;1994-05-15

3. Damage accumulation during high‐dose, O+implantation in Si;Applied Physics Letters;1993-08-16

4. Microstructure of SIMOX buried oxide, mechanisms of defect formation and related reliability issues;Microelectronic Engineering;1993-08

5. Buried SiO2layer formation in Si with an MeV O ion beam;Journal of Applied Physics;1993-02

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