Author:
Hwang J. M.,Bartko J.,Rai-Choudhury P.,Bailey W. E.
Abstract
AbstractIn ionizing-radiation environments, oxide charge buildup in the buried oxide of SIMOX SOI material causes an increase in the back-channel leakage current, resulting in an instability in electronic circuits formed on SIMOX wafers. We report the measured distributions of radiation-induced oxide charge density in buried oxides formed by oxygen implantation. These are obtained by etch-back experiments including C-V measurements using a mercury probe and ellipsometer measurements. The results show a region of higher charge density about 1500A from the top interface with a lower density region within a few hundred angstroms of the top interface. The results also show that the oxide charge density decreases with annealing temperature. Some unusual optical properties of SIMOX oxide observed in ellipsometer measurements are discussed comparatively with thermal oxide.
Publisher
Springer Science and Business Media LLC
Cited by
3 articles.
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