Integrated Optical Isolator Employing Nonreciprocal Phase Shift by Wafer Direct Bonding

Abstract

AbstractA novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of wafer direct bonding technique. This device has a semiconductor guiding layer, so high compatibility in integrating with other semiconductor optical devices is expected.