Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip interconnect
Author:
Abstract
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process
2. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
3. Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration
4. Interfacial reactions on Pb-free solders with Au/Pd/Ni/Cu multilayer substrates
5. Effect of bump size on current density and temperature distributions in flip-chip solder joints
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1. Effect of Annealing Treatment on Electromigration Resistance of Low-Temperature Sn-57Bi-1Ag Solder Interconnect;Journal of Electronic Materials;2024-09-05
2. Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading;Journal of Electronic Packaging;2022-03-08
3. Interaction Between beta-Sn Grain Orientation and Electromigration Behavior in Flip-Chip Lead-Free Solder Bumps;ACTA METALL SIN;2018
4. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect;ACTA METALL SIN;2017
5. Effect of Electromigration on the Type of Drop Failure of Sn–3.0Ag–0.5Cu Solder Joints in PBGA Packages;Journal of Electronic Materials;2015-06-02
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