Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process-Reference-Cited by-同舟云学术

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Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

Published:2011-03 Issue:9 Volume:509 Page:L153-L156
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Yoon Jeong-Won,Noh Bo-In,Yoon Jae-Hyun,Kang Han-Byul,Jung Seung-Boo

Funder

Korean Government (MOEHRD)

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference17 articles.

1. Lead-free Solders in Microelectronics

2. Properties of lead-free solder alloys with rare earth element additions

3. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

4. Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys

5. The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

Cited by 66 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances;Materials Today Communications;2024-06

2. Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics;Journal of Materials Science: Materials in Electronics;2024-04

3. Effect of Nano-Cu6Sn5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints;Materials Characterization;2024-01

4. Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations;Materials Characterization;2024-01

5. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates;Journal of Materials Research and Technology;2023-11

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