Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
Author:
Abstract
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Current-induced marker motion in gold wires
2. High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints
3. In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
4. Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy
5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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