Effects of current densities on creep behaviors of Sn–3.0Ag–0.5Cu solder joint
Author:
Abstract
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference21 articles.
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2. Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions;Soldering & Surface Mount Technology;2022-07-20
3. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density;Journal of Materials Science: Materials in Electronics;2022-06-10
4. Reliability Simulation and Life Prediction of Sn63Pb37 BGA Solder Joint Under Thermal Cycling Load;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26
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