Author:
Oh Chang Yul,Roh Hee-Ra,Kim Young Min,Lee Jin Soo,Cho Hae Young,Kim Young-Ho
Abstract
We developed a new Cu–Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn–Ag–Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu–Zn interfaces after aging. The drop reliability of the SAC solder/Cu–Zn joints was excellent.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
18 articles.
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