Funder
National Science Council, Taiwan
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference27 articles.
1. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization;Lee;J Appl Phys,2001
2. Effects of minor Ni doping on microstructural variations and interfacial reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni sandwich structures;Yu;J Electron Mater,2010
3. Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth;Wang;J Alloys Compd,2009
4. Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish;Zhu,2008
5. Improvement in drop shock reliability of Sn-1.2Ag-0.5Cu BGA interconnects by Ni addition;Tanaka,2006
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献