Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference18 articles.
1. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
2. Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
3. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate
4. Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints
5. Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives
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1. Effects of Sb on the properties and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints;Journal of Materials Research and Technology;2024-05
2. Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder;Soldering & Surface Mount Technology;2024-04-30
3. Eliminating Preferred Orientation and Refining Grain Size with Ni Doping in Cu/Sn-3.0Ag-0.5Cu/Cu TLP Bonding under Isothermal Aging Treatment;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
4. Microstructural and mechanical analysis of Cu/Sn/Cu microbump by doping Ni and Zn into Cu substrate;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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