The Role of Electron and Hole Traps in the Degradation and Breakdown of thermally grown SiO2 Layers

Abstract

AbstractThe degradation and charge build-up of thermally grown silicon diozide layers (with thicknesses varying between 20 and 40 nm) during various stress experiments was investigated. The slow trapping instability generated during charge injection was demonstrated to originate from initially present hole traps. The generation of electron traps in the oxide layer close to the non-injecting interface during high-field stressing was established both for Al-gate and poly-Si gate structures. No evidence could be found for the generation of hole traps during high-field stressing. No bulk oxide charges were detected after a high-field stress, but only unstable near-interface charge trapping was evidenced.