Author:
Gladkikh A.,Lereah Y.,Karpovski M.,Palevski A.,Kaganovskii Yu. S.
Abstract
AbstractActivation energy of electromigration damage was determined as 1.2 eV for Cu lines, indicating grain boundary paths for electromigration. The surface diffusion was found to play a role during electromigration in Cu and impeded the failure process.
Publisher
Springer Science and Business Media LLC
Cited by
8 articles.
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