The Effect of Residual Stresses on the Rupture Properties of Film/Substrate Samples-Reference-Cited by-同舟云学术

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The Effect of Residual Stresses on the Rupture Properties of Film/Substrate Samples

Published:1989 Issue: Volume:153 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Ignat M.,Chouaf A.,Bernard C.,Terriez J.M.

Abstract

AbstractThe residual stresses of two different film/substrate systems were calculated. Besides, several micromechanical tests were performed. Joining the calculated residual stresses to the analysis of the experimental results, some insight on the interfacial adhesion of film/substrate systems is presented.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference12 articles.

1. Determination of Stress in Films on Single Crystalline Silicon Substrates

2. Stress Anisotropy in Evaporated Iron Films

3. Stress analysis of encapsulated fine‐line aluminum interconnect

4. Analysis of stress and strain distribution in thin films and substrates

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical stability and adhesion of ceramic coatings deposited on steels;Surface and Coatings Technology;1991-12

2. Mechanical stability and adhesion of ceramic coatings deposited on steels;Metallurgical Coatings and Thin Films 1991;1991

3. Determination of the elastic constants of a cobalt disilicide intermetallic compound;Journal of Applied Physics;1990-12-15

4. Internal Stresses and Adhesion Properties of Film/Substrate Interfaces;MRS Proceedings;1990

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