Chemical Vapor Deposition (CVD) of Iridium and Platinum Films and Gas-Phase Chemical Etching of Iridium Thin Films

Abstract

AbstractChemical vapor deposition (CVD) of noble metal thin-films is increasingly important for future memory storage applications. Integration of ferroelectric perovskites and/or high permittivity oxides requires specialized metal interconnect technologies. Platinum and iridium are two preferred metal electrode materials being explored since they are highly resistant to corrosion and exhibit excellent stability at high temperatures. Further, the formation of stable oxides (IrO2) provides a mechanism for decreased inter-diffusion of oxygen and elemental film constituents, and provides improved reliability in silicon-based devices. CVD provides conformal electrode films that are required to achieve high-densities; high purity films of both platinum and iridium were deposited in this research, using (β-diketonate)Ir(I)L and (MeCp)Me3Pt(IV) as the precursors.Concurrently, chemical etching of these metals is highly desirable for creating patterns of the electrical contacts and for CVD reactor cleaning. To date, etching of noble metal electrodes has relied upon physical sputtering or chemically assisted etching. In this paper, we also report the first chemical etching of iridium films under ambient conditions, such as room temperature.