Abstract
AbstractEutectic bonding of copper to ceramics makes use of a liquid eutectic between copper and oxygen at 1065°C which wets oxide ceramics very well. Upon solidification of the eutectic melt a very strong bond is established which has a strength of about 5×107N/m2. The excellent bond strength gives this technique important applications in electronic packaging and mechanical engineering.
Publisher
Springer Science and Business Media LLC
Cited by
12 articles.
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