Ti-Interlayer Mediated Epitaxy of CoSi2 with Ti Capping

Author:

Tung R. T.,Schrey F.

Abstract

AbstractThe growth of CoSi2 layers on Si(100) by Ti-interlayer mediated epitaxy (TIME) was studied. The use of a thin (1–3nm) Ti cap, the choice of an appropriate interlayer, and the removal of a metastable reaction by-product were found important for the fabrication of uniform CoSi2 layers. High quality, pinhole-free, single crystal [100]-oriented CoSi2 layers were fabricated. Multiply-oriented formation on heavily arsenic doped Si, void formation near oxide edges, and other salicide-related issues are also discussed.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Texture in thin film silicides and germanides: A review;Applied Physics Reviews;2016-09

2. Interfaces;Materials Science and Technology;2013-02-15

3. Epitaxial silicide formation on recoil-implanted substrates;Journal of Applied Physics;2005-01-15

4. CoSi2 formation with a thin Ti interlayer-Ti capping layer and Ti capping layer;Recent Advances in Multidisciplinary Applied Physics;2005

5. Uniform Void-Free Epitaxial CoSi[sub 2] Formation on STI Bounded Narrow Si(100) Lines by Template Layer Stress Reduction;Electrochemical and Solid-State Letters;2004

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