Subsurface Damage in Polishing Process of Silicon Carbide Ceramic
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/11/4/506/pdf
Reference31 articles.
1. Large-scale fabrication of lightweight Si/SiC ceramic composite optical mirror
2. High-performance grinding of a 2-m scale silicon carbide mirror blank for the space-based telescope
3. Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide
4. Local material removal mechanism considering curvature effect in the polishing process of the small aspherical lens die
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