Study of Selective Dry Etching Effects of 15-Cycle Si0.7Ge0.3/Si Multilayer Structure in Gate-All-Around Transistor Process

Author:

Liu Enxu12,Li Junjie12ORCID,Zhou Na12,Chen Rui12,Shao Hua12,Gao Jianfeng12,Zhang Qingzhu12ORCID,Kong Zhenzhen12ORCID,Lin Hongxiao12,Zhang Chenchen1,Lai Panpan12,Yang Chaoran12,Liu Yang1,Wang Guilei34ORCID,Zhao Chao3,Yang Tao12,Yin Huaxiang12ORCID,Li Junfeng12,Luo Jun12ORCID,Wang Wenwu12

Affiliation:

1. Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing 100029, China

2. Microelectronics Institute, University of Chinese Academy of Sciences, Beijing 100049, China

3. Beijing Superstring Academy of Memory Technology, Beijing 100176, China

4. Hefei National Laboratory, Hefei 230088, China

Abstract

Gate-all-around (GAA) structures are important for future logic devices and 3D-DRAM. Inner-spacer cavity etching and channel release both require selective etching of Si0.7Ge0.3. Increasing the number of channel-stacking layers is an effective way to improve device current-driving capability and storage density. Previous work investigated ICP selective etching of a three-cycle Si0.7Ge0.3/Si multilayer structure and the related etching effects. This study focuses on the dry etching of a 15-cycle Si0.7Ge0.3/Si multilayer structure and the associated etching effects, using simulation and experimentation. The simulation predicts the random effect of lateral etching depth and the asymmetric effect of silicon nanosheet damage on the edge, both of which are verified by experiments. Furthermore, the study experimentally investigates the influence and mechanism of pressure, power, and other parameters on the etching results. Research on these etching effects and mechanisms will provide important points of reference for the dry selective etching of Si0.7Ge0.3 in GAA structures.

Funder

Strategic Priority Research Program of the Chinese Academy of Sciences

Chinese Academy of Sciences Supporting Technology Talent Project

Beijing Superstring Academy of Memory Technology

Development of dry release function for gate-all-around (GAA) nanosheet devices

Innovation Program for Quantum Science and Technology

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Study of Inner Spacer Module Process for Gate All Around Field Effect Transsistors;ECS Journal of Solid State Science and Technology;2024-08-01

2. Study of selective dry etching Si0.7Ge0.3 with different plasma source in process of gate-all-around FET;Advanced Etch Technology and Process Integration for Nanopatterning XIII;2024-04-09

3. Study of precisely controlled selective isotropic quasi-ALE of SiGe;Advanced Etch Technology and Process Integration for Nanopatterning XIII;2024-04-09

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