Effect of Artificial Saliva Modification on the Corrosion Resistance and Electronic Properties of Bego Wirobond® C Dental Alloys
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Published:2023-11-09
Issue:22
Volume:13
Page:12185
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ISSN:2076-3417
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Container-title:Applied Sciences
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language:en
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Short-container-title:Applied Sciences
Author:
Łosiewicz Bożena1ORCID, Osak Patrycja1ORCID, Kubisztal Julian1ORCID, Górka-Kulikowska Karolina2
Affiliation:
1. Institute of Materials Engineering, Faculty of Science and Technology, University of Silesia in Katowice, 41-500 Chorzów, Poland 2. Department of Biomaterials and Experimental Dentistry, Poznan University of Medical Sciences, 60-812 Poznań, Poland
Abstract
Wirobond® C is a commercial dental casting alloy suitable for the fabrication of crowns, bridges, and metal ceramic restorations. This study aims to investigate the effect of ready-to-use Listerine® and Meridol® mouthwashes and sodium fluoride on the resistance of CoCrMo dental alloys to electrochemical corrosion in artificial saliva at 37 °C. SEM, EDS, SKP, and microhardness investigations were carried out to characterize the material under study. The in vitro corrosion resistance of the CoCrMo alloy was conducted using the open-circuit potential method, electrochemical impedance spectroscopy, and anodic polarization curves. The presence of Co 59.8(8) wt.%, Cr 31.5(4) wt.%, and Mo 8.8(6) wt.% was confirmed. The CoCrMo alloy was characterized by a Vickers microhardness value of 445(31) µHV0.3. Based on the EIS data, the capacitive behavior and high corrosion resistance of the CoCrMo alloy were revealed. The kinetics of pitting corrosion in the artificial saliva were lower after being modified with NaF, Listerine®, and Meridol® mouthwashes. The potentiodynamic characteristics revealed the passive behavior of the CoCrMo alloy in all solutions. Based on the SKP measurements of the CoCrMo alloy after corrosion tests, the effect of artificial saliva modification on the electronic properties of Bego Wirobond® C dental alloy was found.
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
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