Towards High Productivity in Precision Grinding
Author:
Publisher
MDPI AG
Subject
General Engineering
Link
http://www.mdpi.com/2411-5134/3/2/24/pdf
Reference46 articles.
1. Modern Grinding Technology;Rowe,2014
2. Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing
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4. Big OptiX Ultra-Precision Grinding/Measuring System;Shore;Proc. SPIE,2005
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