Author:
Goh Chwee,Chong Wee,Lee Teck,Breach Christopher
Subject
Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering
Reference19 articles.
1. Wire Bonding in Microelectronics: Materials, Processes, Reliability and Yield;Harmon,1997
2. Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
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