Active Agents Incorporated in Polymeric Substrates to Enhance Antibacterial and Antioxidant Properties in Food Packaging Applications

Abstract

Active packaging has played a significant role in consumers’ health and green environment over the years. Synthetic polymers, such as poly(ethylene terephthalate) (PET), polyethylene (PE), polypropylene (PP), polystyrene, poly(vinyl chloride) (PVC), polycarbonate (PC), poly(lactic acid) (PLA), etc., and naturally derived ones, such as cellulose, starch, chitosan, etc., are extensively used as packaging materials due to their broad range of desired properties (transparence, processability, gas barrier properties, mechanical strength, etc.). In recent years, the food packaging field has been challenged to deliver food products free from microbes that cause health hazards. However, most of the used polymers lack such properties. Owing to this, active agents such as antimicrobial agents and antioxidants have been broadly used as potential additives in food packaging substrates, to increase the shelf life, the quality and the safety of food products. Both synthetic active agents, such as Ag, Cu, ZnO, TiO2, nanoclays, and natural active agents, such as essential oils, catechin, curcumin, tannin, gallic acid, etc., exhibit a broad spectrum of antimicrobial and antioxidant effects, while restricting the growth of harmful microbes. Various bulk processing techniques have been developed over the years to produce appropriate food packaging products and to add active agents on polymer matrices or on their surface. Among these techniques, extrusion molding is the most used method for mass production of food packaging with incorporated active agents into polymer substrates, while injection molding, thermoforming, blow molding, electrospinning, etc., are used to a lower extent. This review intends to study the antimicrobial and antioxidant effects of various active agents incorporated into polymeric substrates and their bulk processing technologies involved in the field of food packaging.