Influence of Gate Geometry on the Characteristics of AlGaN/GaN Nanochannel HEMTs for High-Linearity Applications
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Published:2023-07-28
Issue:8
Volume:14
Page:1513
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ISSN:2072-666X
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Container-title:Micromachines
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language:en
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Short-container-title:Micromachines
Author:
Zhang Meng1, Chen Yilin2, Guo Siyin1ORCID, Lu Hao1ORCID, Zhu Qing1, Mi Minhan1, Wu Mei1, Hou Bin1, Yang Ling1, Ma Xiaohua1, Hao Yue1
Affiliation:
1. School of Microelectronics, Xidian University, Xi’an 710071, China 2. Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi’an 710071, China
Abstract
In this study, AlGaN/GaN nanochannel high-electron-mobility transistors (HEMTs) with tri-gate (TGN-devices) and dual-gate (DGN-devices) structures were fabricated and investigated. It was found that the peak value of the transconductance (Gm), current gain cut-off frequency (fT) and power gain cut-off frequency (fmax) of the TGN-devices were larger than that of the DGN-devices because of the enhanced gate control from the top gate. Although the TGN-devices and DGN-devices demonstrated flattened transconductance, fT and fmax profiles, the first and second transconductance derivatives of the DGN-devices were lower than those of the TGN-devices, implying an improvement in linearity. With the nanochannel width decreased, the peak value of the transconductance and the first and second transconductance derivatives increased, implying the predominant influence of sidewall gate capacitance on the transconductance and linearity. The comparison of gate capacitance for the TGN-devices and DGN-devices revealed that the gate capacitance of the tri-gate structure was not simply a linear superposition of the top planar gate capacitance and sidewall gate capacitance of the dual-gate structure, which could be attributed to the difference in the depletion region shape for tri-gate and dual-gate structures.
Funder
National Natural Science Foundation of China China National Postdoctoral Program for Innovative Talents China Postdoctoral Science Foundation Fundamental Research Funds for the Central Universities of China
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference37 articles.
1. GaN-Based RF Power Devices and Amplifiers;Mishra;Proc. IEEE,2008 2. Scaling of GaN HEMTs and Schottky Diodes for Submillimeter-Wave MMIC Applications;Shinohara;IEEE Trans. Electron Devices,2013 3. Wu, M., Zhang, M., Yang, L., Hou, B., Yu, Q., Li, S., Shi, C., Zhao, W., Lu, H., and Chen, W. (2022, January 3–7). First Demonstration of State-of-the-art GaN HEMTs for Power and RF Applications on A Unified Platform with Free-standing GaN Substrate and Fe/C Co-doped Buffer. Proceedings of the 2022 International Electron Devices Meeting (IEDM), San Francisco, CA, USA. 4. High-Performance Microwave Gate-Recessed AlGaN/AlN/GaN MOS-HEMT with 73% Power-Added Efficiency;Hao;IEEE Electron Device Lett.,2011 5. Schuh, P., Sledzik, H., Reber, R., Fleckenstein, A., Leberer, R., Oppermann, M., Quay, R., van Raay, F., Seelmann-Eggebert, M., and Kiefer, R. (2008, January 27–28). GaN MMIC based T/R-Module Front-End for X-Band Applications. Proceedings of the EMICC, Amsterdam, The Netherlands.
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