Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/10/8/920/pdf
Reference23 articles.
1. Structure and properties of lead-free solders bearing micro and nano particles
2. Impact of processing conditions and solder materials on surface mount assembly defects
3. A review: On the development of low melting temperature Pb-free solders
4. Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation
5. Microstructure and fracture behavior of non eutectic Sn–Bi solder alloys
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1. Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys;Journal of Electronic Materials;2023-12-27
2. Investigation of the Mechanical Properties of Sn–58Bi/Sn–3Ag–0.5Cu Composite Solder;MATERIALS TRANSACTIONS;2023-11-01
3. High-strength joining of silica glass and 2024 aluminum alloy by ultrasonic-assisted soldering with Sn-Bi low temperature solder;Journal of Manufacturing Processes;2023-09
4. Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers;Journal of Materials Science: Materials in Electronics;2023-09
5. Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers;Journal of Materials Science: Materials in Electronics;2023-09
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