Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. M.-H. Roh, J.P. Jung, W. Kim, Microstructure, shear strength, and nanoindentation property of electroplated Sn–Bi micro-bumps. Microelectron. Reliab. 54, 26–271 (2014)
2. R.M. Shalaby, Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloy. Mater. Sci. Eng. A 560, 86–95 (2013)
3. H. Sun, Q. Li, Y.C. Chan, A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints. J. Mater. Sci. Mater. Electron. 25, 4380–4390 (2014)
4. L. Shen, Z.Y. Tan, Z. Chen, Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers. Mater. Sci. Eng. A 561, 232–238 (2013)
5. Y. Peng, K. Deng, Study on the mechanical properties of the novel Sn–Bi/graphene nanocomposite by finite element simulation. J. Alloys Compd. 625, 44–51 (2015)
Cited by
58 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献