Nanoindentation study on the creep resistance of SnBi solder alloy with reactive nano-metallic fillers
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. F. Hua, Z. Mei, J. Glazer, in: 48th Electronic Components and Technology Conference, 227 (1998).
2. Composite lead-free electronic solders
3. Research advances in nano-composite solders
4. New, creep-resistant, low melting point solders with ultrafine oxide dispersions
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