Determining Surface Topography of a Dressed Grinding Wheel Using Bio-Inspired DNA-Based Computing

Author:

Kubo Akihiko,Teti Roberto,Ullah AMM SharifORCID,Iwadate Kenji,Segreto TizianaORCID

Abstract

Grinding is commonly used for machining parts made of hard or brittle materials with the intent of ensuring a better surface finish. The material removal ability of a grinding wheel depends on whether the wheel surface is populated with a sufficiently high number of randomly distributed active abrasive grains. This condition is ensured by performing dressing operations at regular time intervals. The effectiveness of a dressing operation is determined by measuring the surface topography of the wheel (regions and their distributions on the grinding wheel work surface where the active abrasive grains reside). In many cases, image processing methods are employed to determine the surface topography. However, such procedures must be able to remove the regions where the abrasive grains do not reside while keeping, at the same time, the regions where the abrasive grains reside. Thus, special kinds of image processing techniques are needed to distinguish the non-grain regions from the grain regions, which requires a heavy computing load and long duration. As an alternative, in the framework of the “Biologicalisation in Manufacturing” paradigm, this study employs a bio-inspiration-based computing method known as DNA-based computing (DBC). It is shown that DBC can eliminate non-grain regions while keeping grain regions with significantly lower computational effort and time. On a surface of size 706.5 μm in the circumferential direction and 530 μm in the width direction, there are about 7000 potential regions where grains might reside, as the image processing results exhibit. After performing DBC, this number is reduced to about 300 (representing a realistic estimate). Thus, the outcomes of this study can help develop an intelligent image processing system to optimize dressing operations and thereby, grinding operations.

Publisher

MDPI AG

Subject

General Materials Science

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