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A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging

  • Published:2014-12-16 Issue:12 Volume:14 Page:24244-24257
  • ISSN:1424-8220
  • Container-title:Sensors
  • language:en
  • Short-container-title:Sensors

Author:

Luo Zhenyu,Chen Deyong,Wang Junbo,Li Yinan,Chen Jian

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Reference27 articles.

1. Micromachined pressure sensors: Review and recent developments;Eaton;Smart Mater. Struct.,1997

2. CMOS-compatible capacitive high-temperature pressure sensors;Kasten;Sens. Actuators A Phys.,2000

3. An LTCC-based capacitive pressure sensor with a digital output;Santo;Inf. MIDEM,2010

4. Materials for high-temperature piezoelectric transducers;Damjanovic;Curr. Opin. Solid State Mater. Sci.,1998

5. Electromechanical properties and defect chemistry of high-temperature piezoelectric materials;Schulz;Ionics,2009

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