Influence of Thin Film Deposition on AFM Cantilever Tips in Adhesion and Young’s Modulus of MEMS Surfaces

Abstract

Adhesion is a critical factor in microelectromechanical systems (MEMSs) and is influenced by many parameters. In important fields, such as microassembly, an improved understanding of adhesion can result in higher precision. This study examines the influence of deposition of gold and titanium onto the atomic force microscope (AFM) tips in adhesion forces and Young’s modulus, between a few MEMS substrates (silicon, gold, and silver) and the AFM tips. It was found that, except for gold substrate, an AFM tip coated with gold has the highest adhesion force of 42.67 nN for silicon substrates, whereas the titanium-coated AFM tip decreases the force for all the samples. This study suggests that such changes must be taken into account while studying the adhesion force. The final results indicate that utilizing gold substrate with titanium AFM tip led to the lowest adhesion force, which could be useful in adhesion force measurement during microassembly.