Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/10/7/739/pdf
Reference30 articles.
1. Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles
2. Effect of coating on the microstructure and thermal conductivities of diamond–Cu composites prepared by powder metallurgy
3. Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles
4. Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials
5. Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder
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