Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer-Reference-Cited by-同舟云学术

Sputtered Encapsulation as Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated on a Capacitive Accelerometer

Author:

Hamzah Azrul,Yunas Jumril,Majlis Burhanuddin,Ahmad Ibrahim

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

Reference20 articles.

1. Single Wafer Encapsulation of MEMS Devices;Candler;IEEE Transactions on Advanced Packaging,2003

2. Low Stress Packaging of a Micromachined Accelerometer;Li;IEEE Transactions on Electronics Packaging Manufacturing,2001

3. New Low-Stress PECVD Poly-SiGe Layers for MEMS;Rusu;Journal of Microelectromechanical Systems,2003

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