Single wafer encapsulation of mems devices-Reference-Cited by-同舟云学术

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Single wafer encapsulation of mems devices

Published:2003-08 Issue:3 Volume:26 Page:227-232
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Candler R.N.,Woo-Tae Park ,Huimou Li ,Yama G.,Partridge A.,Lutz M.,Kenny T.W.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/27721/01236521.pdf?arnumber=1236521

Cited by 113 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wafer Level Vacuum Packaging of MEMS-Based Uncooled Infrared Sensors;Micromachines;2024-07-23

2. On-Chip Micro Temperature Controllers Based on Freestanding Thermoelectric Nano Films for Low-Power Electronics;Nano-Micro Letters;2024-02-20

3. Flexible Carbon Nanotube‐Epitaxially Grown Nanocrystals for Micro‐Thermoelectric Modules;Advanced Materials;2023-10-15

4. A Thin Film Porous Alumina Vacuum Package Utilizing a Pore Sealing Getter;Journal of Microelectromechanical Systems;2023-08

5. Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-06

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