Author:
Yan Tian-Hong,Wang Wei,Chen Xue-Dong,Li Qing,Xu Chang
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
Reference21 articles.
1. Microelectronics Packaging Handbook [M];Tummala,1997
2. Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield;Harman,1997
3. Ultrasonic wire-bond quality monitoring using piezoelectric sensor;Or;Sens. Actuat.,1998
4. Reliability model for Al wire bonds subjected to heel crack failures;Ramminger;Microelectron. Reliab.,2000
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献