Ultrasonic wire-bond quality monitoring using piezoelectric sensor-Reference-Cited by-同舟云学术

Ultrasonic wire-bond quality monitoring using piezoelectric sensor

Published:1998-02 Issue:1 Volume:65 Page:69-75
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Or S.W.,Chan H.L.W.,Lo V.C.,Yuen C.W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Effects of ultrasound on deformation characteristics of metals, IEEE Trans;Langenecker;Sonics Ultrasonics,1996

2. The ultrasonic welding mechanism as applied to aluminum and gold wire bonding in microelectronics;Harman;IEEE Trans. Hybrids Packaging,1977

3. The formation of ultrasonic bonds between metals;Joshi;Welding J.,1977

4. Ultrasonic metal welding;Harthoorn,1978

5. Quality control in ultrasonic wire bonding;Rodwell;Hybrid Circuits, No. 7,1985

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