Magnetic Resonance Imaging and Its Effects on Metallic Brackets and Wires: Does It Alter the Temperature and Bonding Efficacy of Orthodontic Devices?

Author:

Sfondrini Maria,Preda LorenzoORCID,Calliada Fabrizio,Carbone Lorenzo,Lungarotti Luca,Bernardinelli Luisa,Gandini Paola,Scribante AndreaORCID

Abstract

Magnetic resonance imaging (MRI) is a widely used diagnostic technique. Patients wearing orthodontic appliances are often requested to remove their appliances, even when the MRI exam involves anatomical areas far from mouth, in order to avoid heating of the metal and detachment of the appliance. The purpose of the present investigation was to measure and compare temperature changes and orthodontic appliances’ adhesion to enamel after different MRIs. A total of 220 orthodontic brackets were bonded on bovine incisors and wires with different materials (stainless steel and nickel titanium). Moreover, various sizes (0.014″ and 0.019″ × 0.025″) were engaged. Appliances were submitted to MRI at two different powers (1.5 T and 3 T). The temperatures of brackets and wires were measured before and after MRI. Subsequently, the shear bond strength (SBS) and adhesive remnant index (ARI) scores were recorded. Statistical analysis was performed. After MRI, a significant increase in the temperature was found for both the brackets and wires in some groups, even if the mean temperature increase was clinically insignificant, as the temperature ranged between 0.05 °C and 2.4 °C for brackets and between 0.42 °C and 1.74 °C for wires. The MRI did not condition bracket adhesion in any group. No differences were reported when comparing the 1.5 T with 3 T groups. The ARI Scores were also significantly lower after MRI. The results of the present report show that, under MRI, orthodontic appliances present a low temperature rise and no debonding risk. Therefore, the removal of orthodontic appliance is not recommended routinely, but is suggested only in the case of a void risk or potential interference in image quality.

Publisher

MDPI AG

Subject

General Materials Science

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