Understanding the Origin of Metal Gate Work Function Shift and Its Impact on Erase Performance in 3D NAND Flash Memories

Author:

Ramesh SivaramakrishnanORCID,Ajaykumar Arjun,Ragnarsson Lars-Åke,Breuil Laurent,El Hajjam Gabriel,Kaczer Ben,Belmonte Attilio,Nyns Laura,Soulié Jean-PhilippeORCID,Van den bosch Geert,Rosmeulen Maarten

Abstract

We studied the metal gate work function of different metal electrode and high-k dielectric combinations by monitoring the flat band voltage shift with dielectric thicknesses using capacitance–voltage measurements. We investigated the impact of different thermal treatments on the work function and linked any shift in the work function, leading to an effective work function, to the dipole formation at the metal/high-k and/or high-k/SiO2 interface. We corroborated the findings with the erase performance of metal/high-k/ONO/Si (MHONOS) capacitors that are identical to the gate stack in three-dimensional (3D) NAND flash. We demonstrate that though the work function extraction is convoluted by the dipole formation, the erase performance is not significantly affected by it.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Study of the Effects of Thermal Budget on 3D-NAND Charge Trap Cell Reliability;2024 IEEE Workshop on Microelectronics and Electron Devices (WMED);2024-03-29

2. Foundations of atomic-level plasma processing in nanoelectronics;Plasma Sources Science and Technology;2022-10-01

3. Editorial for the Special Issue on Flash Memory Devices;Micromachines;2021-12-17

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