A Comparison of 90° Bending for Foldable Electronics
Author:
Affiliation:
1. Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, 8700 Leoben, Austria
2. Business Division Electronics, Plansee SE, 6600 Reutte, Austria
3. Department of Materials Science, Montanuniversität Leoben, 8700 Leoben, Austria
Abstract
Funder
Austrian Research Promotion Agency
Publisher
MDPI AG
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces
Link
https://www.mdpi.com/2079-6412/14/1/98/pdf
Reference35 articles.
1. Saleh, R., Barth, M., Eberhardt, W., and Zimmermann, A. (2021). Bending Setups for Reliability Investigation of Flexible Electronics. Micromachines, 12.
2. The Effect of Bending Loading Conditions on the Reliability of Inkjet Printed and Evaporated Silver Metallization on Polymer Substrates;Glushko;Microelectron. Reliab.,2016
3. Effect of Film Thickness on the Stretchability and Fatigue Resistance of Cu Films on Polymer Substrates;Kim;J. Mater. Res.,2014
4. A Four-Point Bending Technique for Studying Subcritical Crack Growth in Thin Films and at Interfaces;Ma;J. Mater. Res.,1997
5. Mechanical and Environmental Durability of Roll-to-Roll Printed Silver Nanoparticle Film Using a Rapid Laser Annealing Process for Flexible Electronics;Yang;Microelectron. Reliab.,2014
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