TiCl4 Barrier Process Engineering in Semiconductor Manufacturing
Author:
Publisher
MDPI AG
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces
Link
http://www.mdpi.com/2079-6412/6/1/2/pdf
Reference19 articles.
1. Wear resistance investigation of titanium nitride-based coatings
2. Improvement of the properties and electrical performance on TiCl4-based TiN film using sequential flow chemical vapor deposition process
3. Reliability of Multistacked Chemical Vapor Deposited Ti/TiN Structure as the Diffusion Barrier in Ultralarge Scale Integrated Metallization
4. Diffusion barrier property of TiN and TiN/Al/TiN films deposited with FMCVD for Cu interconnection in ULSI
5. Evaluation of Contact and Via Step Coverage Using a Novel Two-Step Titanium Nitride Barrier Deposition Process
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