Investigation of Electrochemical Oxidation Behaviors and Mechanism of Single-Crystal Silicon (100) Wafer under Potentiostatic Mode

Abstract

Electrochemical oxidation (ECO) has been used widely to oxidize single crystal Si wafers. Aiming at optimizing the ECO assisted machining methods, the oxidation behaviors of single- crystal silicon (100) wafer under potentiostatic mode are experimentally investigated. It is shown that the Si wafer can be electrochemically oxidized and the oxidized film thickness reaches to 239.6 nanometers in 20 min. The hardness of the oxidized surface is reduced by more than 50 percent of the original surface. The results indicate that the oxide thickness and the hardness can be controlled by changing the voltage. Based on the experimental findings, a hypothesis on the ECO mechanism under potentiostatic mode was proposed to explain the fluctuations of current density under specific applied voltage. The occurrence of the multiple peaks in the current density curve during the oxidation process is due to the formation of discharge channels, which was initiated from the defects at the interface between the oxide bottom and the substrate. This breaks the electrical isolation and leads to the discontinuous growth of the electrochemical oxide layer. The present work contributes to the fundamental understanding of the ECO behaviors for the single-crystal Si (100) wafer under potentiostatic mode.