Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing

Abstract

Diamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials are damaged, it is difficult to further improve the sawing efficiency and the surface quality based on research conducted on the original machining method. In this paper, a vibration-assisted diamond wire sawing method is proposed. We analyzed the impact of load on the ingot, motion trajectory, and sawing depth of the abrasive particles, and a macroscopic sawing force prediction model for the vibration-assisted sawing method was established and verified via experiments. Based on the single-wire-sawing experiment and prediction model, the influences of the vibration parameters and sawing parameters on the sawing force were determined. The influences of vibration assistance on the surface quality, including the roughness profile, waviness profile, thickness profile, Ra, and Rz, were explored through single-wire-sawing experiments, and the influences of vibration assistance on the geometric parameters of slices, such as the total thickness variation (TTV) and warp, were explored through multi-wire-sawing experiments. It was found that vibration-assisted sawing can reduce sawing force and improve surface quality.