Non-Flammable Epoxy Composition Based on Epoxy Resin DER-331 and 4-(β-Carboxyethenyl)phenoxy-phenoxycyclotriphosphazenes with Increased Adhesion to Metals

Abstract

Functional cyclophosphazenes have proven to be effective modifiers of polymer materials, significantly improving their performance properties, such as adhesive characteristics, mechanical strength, thermal stability, fire resistance, etc. In this study, 4-(β-carboxyethenyl)phenoxy-phenoxycyclotriphosphazenes (CPPP) were obtained by the condensation of 4-formylphenoxy-phenoxycyclotriphosphazene with malonic acid. Its structure was studied using 31P, 1H, and 13C NMR spectroscopy and MALDI-TOF mass spectrometry, and the thermal properties were determined by DSC and TGA methods. Molecular modeling using the MM2 method showed that CPPPs are nanosized with diameters of spheres described around the molecules in the range of 1.34–1.93 nm, which allows them to be classified as nanosized structures. The epoxy resin DER-331 was cured with CPPP, and the conversion of epoxy groups was assessed using IR spectroscopy. Using optical interferometry, it was shown that CPPPs are well compatible with epoxy resin in the temperature range from 80 to 130 °C. It was established that the cured epoxy composition was fire resistant, as it successfully passed the UL-94 vertical combustion test due to the formation of porous coke during the combustion process and also had high heat resistance and thermal stability (decomposition onset temperature about 300 °C, glass transition temperature 230 °C). The composition has low water absorption, high resistance to fresh and salt water, fire resistance, and adhesive strength to steel and aluminum (11 ± 0.2 MPa), which makes it promising for use as an adhesive composition for gluing parts in the shipbuilding and automotive industries, the aviation industry, and radio electronics.