Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
Author:
Publisher
MDPI AG
Subject
General Materials Science
Link
http://www.mdpi.com/1996-1944/10/4/327/pdf
Reference25 articles.
1. Structure and properties of lead-free solders bearing micro and nano particles
2. Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu
3. Interfacial reactions of Sn-Cu/Ni couples at 250 °C
4. Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders
5. Properties and microstructures of SnAgCu– x Eu alloys for concentrator silicon solar cells solder layer
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4. Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2022-07-06
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