Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders-Reference-Cited by-同舟云学术

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Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders

Published:2022-04 Issue:4 Volume:32 Page:1226-1241
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

KANLAYASIRI Kannachai,MOOKAM Niwat

Funder

King Mongkut's Institute of Technology Ladkrabang

Rajamangala University of Technology Suvarnabhumi

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference45 articles.

1. A review: On the development of low melting temperature Pb-free solders [J];KOTADIA;Microelectronics Reliability,2014

2. Thermal fatigue life of Pb–Sn alloy interconnections [J];SATOH;IEEE Transactions on Components, Hybrids, and Manufacturing Technology,1991

3. Lead (Pb)-free solders for electronic packaging [J];KANG;Journal of Electronic Materials,1994

4. Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni [J];TAO;Journal of Alloys and Compounds,2017

5. A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded [J];PECHT;Microelectronics Reliability,2016

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1. Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification;Journal of Electronic Materials;2024-04-10

2. Insight into the influence of Cu6Sn5/Cu micro-interface configuration on growth behavior of Cu-Sn interfacial intermetallic compounds in Sn/Cu solder joint;Materials Today Communications;2024-03

3. Optimization of the Solid-State Copper Brazing Condition Using Desirability Function and Genetic Algorithm;Arabian Journal for Science and Engineering;2024-02-29

4. Influence of Sb on the Performance and Interfacial Behavior of SnBiAg-xSb/Cu Solder Joints;Journal of Electronic Materials;2023-09-22

5. Effect of the Solder Powder Size of Sn-Bi-Ag-In Lead-Free Solder on the Wettability and Microstructure of Cu Substrate;Materials Performance and Characterization;2023-06-16

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