New Wafer Alignment Process Using Multiple Vision Method for Industrial Manufacturing-Reference-Cited by-同舟云学术

New Wafer Alignment Process Using Multiple Vision Method for Industrial Manufacturing

Published:2018-03-11 Issue:3 Volume:7 Page:39
ISSN:2079-9292
Container-title:Electronics
language:en
Short-container-title:Electronics

Author:

KIM Jongwon^ORCID

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

Link

http://www.mdpi.com/2079-9292/7/3/39/pdf

Reference9 articles.

1. Classification of Land Use on Sand-Dune Topography by Object-Based Analysis, Digital Photogrammetry, and GIS Analysis in the Horqin Sandy Land, China

2. Pixel detectors for particle physics and imaging applications

3. A Local Texture-Based Superpixel Feature Coding for Saliency Detection Combined with Global Saliency

4. A Wafer Alignment Method and Accuracy Evaluation

5. Algorithm for automatic alignment in 2D space by object transformation

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