Temporary Bonding and Debonding - An Update on Materials and Methods-Reference-Cited by-同舟云学术

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Temporary Bonding and Debonding - An Update on Materials and Methods

Published:2014-06-20 Issue: Volume: Page:147-158
ISSN:
Container-title:Handbook of 3D Integration
language:
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Author:

Bair Wilfried

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Reference8 articles.

1. Trott , G.R. Shorey , A. 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference

2. http://www.imec.be/ScientificReport/SR2009/HTML/1213307.html

3. http://www.nanometrics.com/process_control/3D-packaging.html

4. Tamura , K. 2010 Proceedings of the 60th Electronic Components and Technology Conference, June 2010 1239 1244

5. Thin wafer handling challenges and emerging solutions;Farrens;ECS Transactions,2010

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Au–Au Bonding-Associated Lapping and Polishing Technique for Sapphire-Based Fabry–Perot Acoustic Sensor Applied for Harsh Environment;IEEE Sensors Journal;2022-10-01

2. Fundamentals and Failures in Die Preparation for 3D Packaging;3D Microelectronic Packaging;2020-11-24

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