Temperature dependence of aging drift in CuNi films on alumina ceramic substrates-Reference-Cited by-同舟云学术

Temperature dependence of aging drift in CuNi films on alumina ceramic substrates

Published:1993-11-16 Issue:1 Volume:140 Page:K21-K24
ISSN:0031-8965
Container-title:Physica Status Solidi (a)
language:de
Short-container-title:Phys. Stat. Sol. (a)

Author:

Brückner W.,Schumann J.,Griessmann H.

Publisher

Wiley

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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2. , and , Symp. Wer macht was in den physikalischen Technologien, 11. to 13. 6. 1990, Berlin, VDI-Technologiezentrum Physikalische Technologien. Düsseldorf 1990, Vol. Poster I (p. 221).

3. , , and , Proc. ELMAT 91, 22. to 24. 1. 1991, Essen, Vde-Verlag GmbH, Berlin/Offenbach 1991 (p. 181).

4. Influence of the substrate on the annealing behaviour of sputter-deposited NiCr films

5. Degradation of CrSi(W)O resistive films

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1. Degradation of NiCr/CuNiMn/NiCr films on alumina substrates;Thin Solid Films;1996-07

2. Mechanical Properties of CuNi Films;MRS Proceedings;1996

3. Simulation of the electric properties of the near-contact area in thin film resistor systems;Physica Status Solidi (a);1995-09-16

4. Biaxial modulus and coefficient of thermal expansion of Cu0.57Ni0.42Mn0.01 (constantan) films;Physica Status Solidi (a);1995-04-16

5. Oxidation behaviour of Cu-Ni(Mn) (constantan) films;Thin Solid Films;1995-03