Biaxial modulus and coefficient of thermal expansion of Cu0.57Ni0.42Mn0.01 (constantan) films-Reference-Cited by-同舟云学术

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Biaxial modulus and coefficient of thermal expansion of Cu0.57Ni0.42Mn0.01 (constantan) films

Published:1995-04-16 Issue:2 Volume:148 Page:K89-K91
ISSN:0031-8965
Container-title:Physica Status Solidi (a)
language:de
Short-container-title:Phys. Stat. Sol. (a)

Author:

Brückner W.

Publisher

Wiley

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Praktische Physik, Vol. 3, B. G. Teubner, Stuttgart 1968 (p. 85).

2. , , and , Proc. ELMAT 91, 22-24 January 1991, Essen, vde-Verlag GmbH, Berlin/Offenbach 1991 (p. 181).

3. Temperature dependence of aging drift in CuNi films on alumina ceramic substrates

4. , , and , to be published.

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1. Stress measurements in thermal loaded (Ti,Al)N hard coatings;Surface and Coatings Technology;2001-07

2. Abnormal grain growth of sputtered CuNi(Mn) thin films;Journal of Materials Research;2000-05

3. Stress and oxidation in CuNi thin films;Thin Solid Films;1999-11

4. Mechanical Stress, Grain-boundary Relaxation, and Oxidation of Sputtered CuNi(Mn) Films;Journal of Materials Research;1999-04

5. Stress relaxation in CuNi thin films;Journal of Applied Physics;1999-04

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