Size and Constraining Effects in Lead-Free Solder Joints
Author:
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Reference37 articles.
1. Long term mechanical reliability with lead‐free solders
2. Constitutive and damage model for a lead-free solder
3. Mechanical characterization of Sn–Ag-based lead-free solders
4. Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
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3. Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography;JOM;2016-07-28
4. Constitutive modeling of pressure dependent plasticity and fracture in solder joints;International Journal of Solids and Structures;2012-11
5. Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints;Scripta Materialia;2012-10
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