Impact of AlN Seed Layer on Microstructure and Piezoelectric Properties of Y x Al 1− x N ( x = 15%) Thin Films
Author:
Affiliation:
1. Institute of Sensor and Actuator Systems TU Wien Gusshausstrasse 27–29 Vienna A‐1040 Austria
2. University Service Center for Transmission Electron Microscopy (USTEM) TU Wien Wiedner Hauptstrasse 8–10/057‐02 Vienna 1040 Austria
Publisher
Wiley
Subject
Electronic, Optical and Magnetic Materials
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/aelm.202200789
Reference35 articles.
1. Piezoelectric aluminum nitride thin films for microelectromechanical systems
2. Materials, Design, and Characteristics of Bulk Acoustic Wave Resonator: A Review
3. AlN MEMS filters with extremely high bandwidth widening capability
4. Growth and applications of Group III-nitrides
5. Thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Compressive stress reduction in sputter-deposited yttrium aluminum nitride (Y0.2Al0.8N) thin films for BAW resonators with high electromechanical coupling;Sensors and Actuators A: Physical;2024-10
2. Simultaneously realizing reversal of piezoelectric coefficient and enhancement of piezoresponse by chromium-doping in aluminum nitride films;Applied Physics Letters;2024-04-08
3. Aluminum Nitride Thin Film Piezoelectric Pressure Sensor for Respiratory Rate Detection;Sensors;2024-03-24
4. Band alignment and charge carrier transport properties of YAlN/III-nitride heterostructures;Applied Surface Science;2023-11
5. Enhancement of Piezoelectric Response in Yttrium Aluminum Nitride (YxAl1‐xN) Thin Films;Advanced Engineering Materials;2023-10-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3