M-Series™ Fan-Out with Adaptive Patterning™
Author:
Olson Tim1,
Scanlan Chris1
Publisher
John Wiley & Sons, Inc.
Reference6 articles.
1. Rogers , B. Olson , T. Scanlan , C. 2013 Implementation of a fully molded fan-out packaging technology IWLPC Proceedings
2. Bishop , C. Olson , T. Scanlan , C. 2016 Adaptive patterning design methodologies 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Las Vegas, NV 7 12
3. Brunnbauer , M. Fürgut E. Beer , G. Meyer , T. 2006 Embedded wafer level ball grid array (eWLB) Electronics Packaging Technology Conference 8th Proceedings
4. Keser , B. Amrine , C. Leal G. 2007 The redistributed chip package: a breakthrough for advanced packaging 2007 Electronic Components and Technology Conference 286 291
5. Zhao , W. Nakamoto , M. Dhandapani , K. 2017 Electrical chip-board interaction (e-CBI) of wafer level packaging technology IMAPS Advancing Microelectronics